Techbond Group Berhad

Techbond Group Berhad

Share · MYL5289OO003 (XKLS)
Overview
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Latest AI Analyses of Techbond Group Berhad
No Price
Closing Price XKLS 29.04.2026: 0,28 MYR
29.04.2026 08:17
Current Prices from Techbond Group Berhad
ExchangeTickerCurrencyLast TradePriceDaily Change
XKLS: BURSA MALAYSIA
BURSA MALAYSIA
5289.KL
MYR
29.04.2026 08:17
0,28 MYR
0,00 MYR
Share Float & Liquidity
Free Float 28,84 %
Shares Float 218,84 M
Shares Outstanding 758,7 M
Company Profile for Techbond Group Berhad Share
Techbond Group Berhad develops, manufactures, and trades in industrial adhesives and sealants in Malaysia, Vietnam, Indonesia, China, and internationally. The company offers industrial adhesives, including water-based and hot melt adhesives; and industrial sealants, such as water-based and solvent-based sealants. It also provides products and services comprising original equipment manufacturer industrial adhesives, chemicals, and adhesive repellents and cleaners, as well as adhesive blending machines; and cleaners, spare parts, and maintenance services. In addition, the company manufactures and markets phenolic resins, paper resins, additives, formalin, and phenoset microspheres. The company's industrial adhesives are used in manufacturing a range of products, including wood-based products, paper and packaging products, cigarettes and cigarette packs, automotive applications, personal care products, bookbinding, and mattresses, as well as building and construction applications. It also exports its products. The company was founded in 1992 and is headquartered in Shah Alam, Malaysia. Techbond Group Berhad is a subsidiary of Sonicbond Sdn. Bhd.

Company Data

Name Techbond Group Berhad
Company Techbond Group Berhad
Website https://www.techbond.com.my
Primary Exchange XKLS BURSA MALAYSIA
ISIN MYL5289OO003
Asset Class Share
Sector Basic Materials
Industry Chemicals - Specialty
CEO Seh Meng Lee
Market Capitalization 212 Mio
Country Malaysia
Currency MYR
Employees 0,2 T
Address No. 36, Jalan Anggerik Mokara 31/59, 40460 Shah Alam
IPO Date 2018-12-05
Dividends from 'Techbond Group Berhad'
Ex-Date Dividend per Share
05.12.2025 0,008 MYR
20.11.2024 0,01 MYR
12.06.2024 0,005 MYR
30.11.2023 0,008 MYR
29.12.2022 0,005 MYR
10.09.2021 0,005 MYR
21.12.2020 0,01 MYR
20.09.2019 0,02 MYR

Stock Splits

Date Split
25.03.2021 9:4

Ticker Symbols

Name Symbol
BURSA MALAYSIA 5289.KL
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