QUALCOMM 20/50
QUALCOMM 20/50
Bond · US747525BJ18 · A28W7Q (XMUN)
Overview
No Price
n/a

Performance

Day Week Month 3 Months 6 Months 1 Year 5 Years
- - - - - - -

Invested Funds

The following funds have invested in: QUALCOMM 20/50 invested:

Fund
iShares US Aggregate Bond UCITS ETF EUR Hedged (Acc)
Vol. in million
14,85
Percentage (%)
0,0057 %
Fund
iShares US Aggregate Bond UCITS ETF USD (Acc)
Vol. in million
110,61
Percentage (%)
0,0057 %
Fund
iShares Core Global Aggregate Bond UCITS ETF USD Hedged (Dist)
Vol. in million
6,21
Percentage (%)
0,002 %
Fund
iShares Core Global Aggregate Bond UCITS ETF USD Hedged (Acc)
Vol. in million
39,44
Percentage (%)
0,002 %
Fund
iShares Core Global Aggregate Bond UCITS ETF GBP Hedged (Dist)
Vol. in million
7,19
Percentage (%)
0,002 %

Company Data

Name QUALCOMM 20/50
Primary Exchange XMUN BOERSE MUENCHEN
WKN A28W7Q
ISIN US747525BJ18
Asset Class Bond
Coupon 3,25 %
Denomination 2.000,00 USD
Issue Date 08.05.2020
Maturity Date 20.05.2050
Currency USD

More Shares

Investors who QUALCOMM 20/50 hold also have the following shares in their portfolio:
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SOUTHERN SUN LTD. Share
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