QUALCOMM 20/50
QUALCOMM 20/50
Bond · US747525BJ18 · A28W7Q (XMUN)
Overview
No Price
29.01.2026 16:24
Current Prices from QUALCOMM 20/50
ExchangeTickerCurrencyLast TradePriceDaily Change
XDUS: Düsseldorf
Düsseldorf
QUALCO18.DUSB
EUR
29.01.2026 16:24
68,58 %
Invested Funds

The following funds have invested in QUALCOMM 20/50:

Fund
iShares US Aggregate Bond UCITS ETF USD (Acc)
Vol. in million
110,61
Percentage (%)
0,0057 %
Fund
iShares US Aggregate Bond UCITS ETF EUR Hedged (Acc)
Vol. in million
14,85
Percentage (%)
0,0057 %
Fund
iShares Core Global Aggregate Bond UCITS ETF EUR Hedged (Acc)
Vol. in million
27,97
Percentage (%)
0,002 %
Fund
iShares Core Global Aggregate Bond UCITS ETF USD Hedged (Dist)
Vol. in million
6,21
Percentage (%)
0,002 %
Fund
iShares Core Global Aggregate Bond UCITS ETF USD Hedged (Acc)
Vol. in million
39,44
Percentage (%)
0,002 %
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Company Data

Name QUALCOMM 20/50
Primary Exchange XMUN BOERSE MUENCHEN
WKN A28W7Q
ISIN US747525BJ18
Asset Class Bond
Coupon 3,25 %
Denomination 2.000,00 USD
Issue Date 08.05.2020
Maturity Date 20.05.2050
Currency USD

Ticker Symbols

Name Symbol
Düsseldorf QUALCO18.DUSB
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