HPSP Co., Ltd.

HPSP Co., Ltd.

Share · KR7403870009 (XKOS)
Overview
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Latest AI Analyses of HPSP Co., Ltd.
No Price
Closing Price XKOS 29.04.2026: 53.400,00 KRW
29.04.2026 06:30
Current Prices from HPSP Co., Ltd.
ExchangeTickerCurrencyLast TradePriceDaily Change
XKOS: KOSDAQ
KOSDAQ
403870.KQ
KRW
29.04.2026 06:30
53.400,00 KRW
-300,00 KRW
-0,56 %
Share Float & Liquidity
Free Float 56,91 %
Shares Float 45,96 M
Shares Outstanding 80,76 M
Company Profile for HPSP Co., Ltd. Share
HPSP Co., Ltd manufactures and markets high pressure annealing semiconductor equipment in South Korea and internationally. It offers GENI-SYS, a high-pressure thermal processing advance system; GENI, a high-pressure thermal processing system; and GENI-SE, a high-pressure oxidation system. The company also provides parts, parts repair and exchanges, installation support, and technical support services. HPSP Co., Ltd was founded in 2005 and is based in Suwon, South Korea.

Company Data

Name HPSP Co., Ltd.
Company HPSP Co., Ltd.
Website https://www.thehpsp.com
Primary Exchange XKOS KOSDAQ
ISIN KR7403870009
Asset Class Share
Sector Technology
Industry Semiconductors
CEO Choonheung Lee
Market Capitalization 4.337 Mrd.
Country South Korea
Currency KRW
Employees 0,1 T
Address 65, Omokcheon-ro 152 beon-gil, 16642 Suwon
IPO Date 2022-07-15
Dividends from 'HPSP Co., Ltd.'
Ex-Date Dividend per Share
29.12.2025 600,00 KRW
27.12.2024 150,00 KRW
27.12.2023 37,50 KRW
28.12.2022 600,00 KRW

Stock Splits

Date Split
16.03.2023 4:1

Ticker Symbols

Name Symbol
KOSDAQ 403870.KQ
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