Techbond Group Berhad
Techbond Group Berhad
Aktie · MYL5289OO003 (XKLS)
Übersicht
Kein Kurs
Schlusskurs XKLS 09.12.2025: 0,31 MYR
09.12.2025 08:08
Aktuelle Kurse von Techbond Group Berhad
BörseTickerWährungLetzter UmsatzKursTagesveränderung
XKLS: BURSA MALAYSIA
BURSA MALAYSIA
5289.KL
MYR
09.12.2025 08:08
0,31 MYR
-0,005 MYR
-1,59 %
Free Float & Liquidität
Free Float 29,40 %
Shares Float 223,07 M
Ausstehende Aktien 758,7 M
Firmenprofil zu Techbond Group Berhad Aktie
Techbond Group Berhad develops, manufactures, and trades in industrial adhesives and sealants in Malaysia, Vietnam, Indonesia, China, and internationally. The company offers industrial adhesives, including water-based and hot melt adhesives; and industrial sealants, such as water-based and solvent-based sealants. It also provides products and services comprising original equipment manufacturer industrial adhesives, chemicals, and adhesive repellents and cleaners, as well as adhesive blending machines; and cleaners, spare parts, and maintenance services. In addition, the company manufactures and markets phenolic resins, paper resins, additives, formalin, and phenoset microspheres. The company's industrial adhesives are used in manufacturing a range of products, including wood-based products, paper and packaging products, cigarettes and cigarette packs, automotive applications, personal care products, bookbinding, and mattresses, as well as building and construction applications. It also exports its products. The company was founded in 1992 and is headquartered in Shah Alam, Malaysia. Techbond Group Berhad is a subsidiary of Sonicbond Sdn. Bhd.
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Unternehmensdaten

Name Techbond Group Berhad
Firma Techbond Group Berhad
Website https://www.techbond.com.my
Heimatbörse XKLS BURSA MALAYSIA
ISIN MYL5289OO003
Wertpapierart Aktie
Sektor Basic Materials
Branche Chemicals - Specialty
CEO Seh Meng Lee
Marktkapitalisierung 235 Mio
Land Malaysia
Währung MYR
Mitarbeiter 0,2 T
Adresse No. 36, Jalan Anggerik Mokara 31/59, 40460 Shah Alam
IPO Datum 2018-12-05
Dividenden von 'Techbond Group Berhad'
Ex-Datum Dividende pro Aktie
05.12.2025 0,008 MYR

Ticker Symbole

Name Symbol
BURSA MALAYSIA 5289.KL
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