Japan Pure Chemical Co., Ltd. develops, manufactures, and sells metal plating chemicals for electronic devices in Japan. The company provides gold electroplating formulation for semiconductor applications; gold electroplating formulation for PWB, connector, contact, and soldering uses; strike gold plating formulation that enhances the adherence of plated coatings; flash gold plating formulation for leadframe uses; and palladium electroplating formulation for connector, leadframe, and decorative uses. It also offers gold coating for soldering and wire bonding; electroless palladium plating formulation for wire bonding and soldering uses; and silver-plating formulations. In addition, the company provides non-cyanide immersion silver plating formulations on Cu surfaces; anti-microbial agents for plating tanks and drag-out tanks; impurity removal resin that removes Cu ions dissolved in Au and Pd bath solutions; and carbon filter that is applied to JPC plating chemicals. Additionally, it offers other surface treatment chemicals and stripping agents. Japan Pure Chemical Co., Ltd. was founded in 1971 and is based in Tokyo, Japan.