PLAINS AM.P.L.P 2023
PLAINS AM.P.L.P 2023
Bond · US72650RBD35 · A1HPYW (XNYS)
Overview
No Price
n/a
Invested Funds

The following funds have invested in PLAINS AM.P.L.P 2023:

Fund
iShares $ Short Duration Corp Bond UCITS ETF USD (Acc)
Vol. in million
561,70
Percentage (%)
0,02 %
Get up to date insights from finAgent about PLAINS AM.P.L.P 2023

Company Data

Name PLAINS AM.P.L.P 2023
Primary Exchange XNYS NYSE
WKN A1HPYW
ISIN US72650RBD35
Asset Class Bond
Coupon 3,85 %
Denomination 2.000,00 USD
Issue Date 15.08.2013
Maturity Date 15.10.2023
Currency USD
More Shares
Investors who hold PLAINS AM.P.L.P 2023 also have the following shares in their portfolio:
CLOUDIA RESEARCH SPA O.N.
CLOUDIA RESEARCH SPA O.N. Share
Shenzhen Cheng Chung Design Co., Ltd.
Shenzhen Cheng Chung Design Co., Ltd. Share
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