Mi Technovation Berhad, an investment holding company, designs, develops, manufactures, and sells wafer level chip scale packaging (WLCSP) sorting machines for the semiconductor industry in Southeast Asia, Northeast Asia, and North Atlantic. The company operates through three segments: Semiconductor Equipment Business Unit, Semiconductor Material Business Unit, and Others. It offers Mi and Vi series products for advanced packaging die and package sorting machines with vision inspection and other applicable functions, as well as wafer and package inspection in 2D and 3D modes for smartphones, tablets, wireless wearable devices, Bluetooth, near field sensing, and sensor applications. The company also provides Ai series product, a precision bonding machine for extra fine pitch with think die and substrate thickness used in telecommunications industry, GPU and CPU for high performance computing application in AI and blockchain, and image sensor and memory applications; and Si series, a final and power test equipment for high power and fine pitch devices used in electric vehicles and telecommunications applications. In addition, it is involved in the provision of maintenance services and technical support for its machines; sale of related spare parts and components; and manufacture and sale of solder spheres and other semiconductor-related materials. The company was formerly known as Mi Equipment Holdings Berhad and changed its name to Mi Technovation Berhad in December 2018. Mi Technovation Berhad was founded in 2007 and is headquartered in Bayan Lepas, Malaysia.