QUALCOMM 17/27
QUALCOMM 17/27
Bond · US747525AU71 · A19H4Q (XFRA)
Overview
No Price
n/a

Performance

Day Week Month 3 Months 6 Months 1 Year 5 Years
- - - - - - -

Invested Funds

The following funds have invested in: QUALCOMM 17/27 invested:

Fund
iShares $ Intermediate Credit Bond UCITS ETF
Vol. in million
5,74
Percentage (%)
0,0027 %

Company Data

Name QUALCOMM 17/27
Primary Exchange XFRA Frankfurt
WKN A19H4Q
ISIN US747525AU71
Asset Class Bond
Coupon 3,25 %
Denomination 2.000,00 USD
Issue Date 26.05.2017
Maturity Date 20.05.2027
Currency USD

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