HEICO CORP 23/28 Anleihe - Unternehmensdaten & Kurse - US422806AA75 | MoneyPeak

HEICO CORP 23/28

Bond · US422806AA75 · A3LLGD (XNYS)

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Company Data

Name HEICO CORP 23/28

Primary Exchange

Frankfurt

WKN A3LLGD

ISIN US422806AA75

Asset Class Bond

Coupon 5,25 %

Denomination 2.000,00 USD

Issue Date 27.07.2023

Maturity Date 01.08.2028

Currency USD

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