Tong Hsing Electronic Industries, Ltd. develops, manufactures, and sells micro modules and custom semiconductor packages in Taiwan. The company provides semiconductor micro module assembly, and thick and thin film substrate foundry services. It also offers microelectronic packaging technologies, such as assembly packaging services, backend technology and others, and RF testing services. In addition, the company provides contract manufacturing services for microelectronic packaging and ceramic thick/thin film substrate fabrication. Its products are used in IGBT, high-frequency switching power supply, automotive, aerospace, solar cell component, telecommunication power supply, laser system, high power LED, microwave, semiconductor process equipment, hybrid electric vehicles, computer peripherals, medical and network equipment, and sensor applications. The company was founded in 1974 and is headquartered in Taipei, Taiwan.