Lasertec Corporation
Lasertec Corporation
Share · JP3979200007 (XTKS)
Overview
No Price
Closing Price XTKS 06.03.2026: 33.340,00 JPY
06.03.2026 07:01
Current Prices from Lasertec Corporation
ExchangeTickerCurrencyLast TradePriceDaily Change
XHAM: Hamburg
Hamburg
LCRSN07.HAMB
EUR
06.03.2026 07:01
180,00 EUR
0,00 EUR
XDQU: Quotrix
Quotrix
LCRSN07.DUSD
EUR
06.03.2026 06:27
182,00 EUR
2,00 EUR
+1,11 %
XTKS: Tokyo
Tokyo
6920.T
JPY
06.03.2026 05:44
33.340,00 JPY
-210,00 JPY
-0,63 %
OTC: UTC
UTC
LSRCF
USD
05.03.2026 21:00
212,06 USD
11,30 USD
+5,63 %
XDUS: Düsseldorf
Düsseldorf
LCRSN07.DUSB
EUR
05.03.2026 18:31
175,00 EUR
-5,00 EUR
-2,78 %
XFRA: Frankfurt
Frankfurt
6K8.F
EUR
27.02.2026 07:09
180,00 EUR
-
Share Float & Liquidity
Free Float 86,77 %
Shares Float 78,19 M
Shares Outstanding 90,11 M
Invested Funds

The following funds have invested in Lasertec Corporation:

Fund
iShares MSCI Japan ESG Screened UCITS ETF USD (Dist)
Vol. in million
512,99
Percentage (%)
0,42 %
Fund
iShares MSCI Japan ESG Screened UCITS ETF USD (Acc)
Vol. in million
3.444,70
Percentage (%)
0,42 %
Fund
iShares MSCI Japan EUR Hedged UCITS ETF (Acc)
Vol. in million
3.824,71
Percentage (%)
0,42 %
Fund
iShares MSCI Japan UCITS ETF USD (Acc)
Vol. in million
2.513,72
Percentage (%)
0,42 %
Fund
iShares MSCI Japan CHF Hedged UCITS ETF (Acc)
Vol. in million
937,57
Percentage (%)
0,41 %
Company Profile for Lasertec Corporation Share
Lasertec Corporation develops, manufactures, sells, and services semiconductor-related equipment, laser microscopes, and flat panel display-related equipment worldwide. The company provides systems used to inspect and measure defects on semiconductor photomasks and wafers; wafer related systems, such as SiC, GaN, multi-wavelength, and wafer edge inspection and review systems; wafer bump inspection and measurement systems; and TSV back grinding process measurement systems. It also offers flat panel display photomask inspection systems; laser microscopes, which are used for the observation and measurement of various materials and components comprising semiconductor materials, transparent films, coating materials, inorganic and organic materials, biological samples, metal parts, and plastic components; and lithium-Ion batteries. The company was formerly known as NJS Corporation and changed its name to Lasertec Corporation in 1986. Lasertec Corporation was founded in 1960 and is headquartered in Yokohama, Japan.
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Company Data

Name Lasertec Corporation
Company Lasertec Corporation
Website https://www.lasertec.co.jp
Primary Exchange XTKS Tokyo
ISIN JP3979200007
Asset Class Share
Sector Technology
Industry Semiconductors
CEO Tetsuya Sendoda
Market Capitalization 19 Mrd.
Country Japan
Currency JPY
Employees 1,0 T
Address 2-10-1 Shin-yokohama, 222-8552 Yokohama
IPO Date 2010-02-22
Dividends from 'Lasertec Corporation'
Ex-Date Dividend per Share
31.12.2025 132,00 JPY
29.12.2025 132,00 JPY
30.06.2025 214,00 JPY
31.12.2024 115,00 JPY
28.06.2024 157,00 JPY
29.12.2023 73,00 JPY
29.06.2023 128,00 JPY
30.12.2022 52,00 JPY
29.06.2022 65,00 JPY
29.06.2021 55,00 JPY

Stock Splits

Date Split
29.03.2017 2:1
26.06.2013 2:1

Ticker Symbols

Name Symbol
Over The Counter LSRCF
Düsseldorf LCRSN07.DUSB
Frankfurt 6K8.F
Hamburg LCRSN07.HAMB
Quotrix LCRSN07.DUSD
Tokyo 6920.T
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AMUNDI FUNDS JAPAN EQUITY ENGAGEMENT - M2 EUR (C) ETF
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