Huizhou CEE Technology Inc. focuses on the research and development, production, sales and service of printed circuit boards in China and internationally. The company offers rigid circuit boards (RPCBs), high-density interconnect boards (HDIs), flexible circuit boards (FPCs), rigid-flexible boards (RFs) and flexible circuit board assemblies (FPCAs), and rigid-flexible printed circuit boards. The company also offers high-layer circuit boards (HLC), high-order HDI and AnylayerHDI, and rigid-flexible boards (RF), and has deeply penetrated emerging market fields such as network communications, new high-definition displays, new energy automotive electronics, data centers, artificial intelligence, the Internet of Things, big data and cloud computing. Its products are used in consumer electronics, network communication, automotive electronics, latest display, security and industrial control, medical and health, artificial intelligence, big data and cloud computing, IOT, Biometrics, smart wear, the smart home, and drones. The company was formerly known as Huizhou China Eagle Electronic Technology Inc. and changed its name to Huizhou CEE Technology Inc. in June 2024. Huizhou CEE Technology Inc. was founded in 2000 and is headquartered in Huizhou, China.